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LED aluminum substrate professional knowledge

May 18, 2017

Characteristics, structure and function of aluminum substrate

LED cooling problem is the most troublesome LED manufacturers, but can use aluminum plate, because the aluminum thermal conductivity is high, good heat dissipation, can effectively export the internal heat. Aluminum plate is a unique metal-based CCL, with good thermal conductivity, electrical insulation properties and mechanical processing performance. Design should also try to PCB near the aluminum base, thereby reducing the potting part of the thermal resistance generated.


First, the characteristics of aluminum plate

1. Using surface mount technology (SMT);

2. In the circuit design of the thermal diffusion of the extremely effective treatment;

3. Reduce the product operating temperature, improve product power density and reliability, extend product life;

4. Reduce product size, reduce hardware and assembly costs;

5. Replace the fragile ceramic substrate, get better mechanical durability.

Second, the structure of aluminum plate

Aluminum-based CCL is a metal circuit board material, from the copper foil, thermal insulation layer and metal substrate composition, its structure is divided into three layers:

Cireuitl.Layer Line layer: the equivalent of ordinary PCB CCL, line copper foil thickness loz to 10oz.

DielcctricLayer Insulation: Insulation is a layer of low thermal resistance thermal insulation material.

BaseLayer Base: is a metal substrate, usually aluminum or can choose copper. Aluminum-based CCL and the traditional epoxy glass cloth laminates and so on.

Circuit layers (ie, copper foil) are usually etched to form a printed circuit, so that the various components of the components connected to each other, under normal circumstances, the circuit layer requires a large current carrying capacity, which should use thick copper foil, the thickness of 35μm ~ 280μm; thermal insulation layer is the core technology of aluminum substrate, it is generally filled with special ceramic special polymer composition, thermal resistance, viscoelastic performance, with the ability to heat aging, can withstand mechanical and thermal stress.

High-performance aluminum substrate thermal insulation layer is the use of this technology, it has a very good thermal conductivity and high strength electrical insulation properties; metal substrate is the aluminum plate support components, requires a high thermal conductivity, generally aluminum , Can also use copper (which copper plate can provide better thermal conductivity), suitable for drilling, punching and cutting and other conventional machining. PCB material compared with other materials have incomparable advantages. Suitable for power components surface mount SMT art. No need for radiator, greatly reduced size, excellent heat dissipation, good insulation and mechanical properties.



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