I. Introduction
1.led the main raw material for the LED, LED mainly rely on the chip to light. The following are the same as the "
2.led chip is a solid-state LED lighting device, is a P-N knot, it can be directly converted into light. LED heart is an LED lighting chip, one end of the chip attached to a bracket, one end is negative, the other end of the power supply connected to the cathode, so that the entire chip is encapsulated by epoxy resin.
Composition
1.la wafer composition: arsenic (AS) aluminum (AL) gallium (Ga) indium (IN) phosphorus (P) nitrogen (N) strontium (Si) several elements of these elements. The following are the same as the "
2.led chip composition: by the gold pad, P pole, N pole, PN junction, back gold layer composition (double pad chip back gold layer) composition.
Classification
1.Led
1) according to the luminous brightness points:
A. General brightness: R ﹑ H ﹑ G ﹑ Y ﹑ E, etc .; B. High brightness: VG ﹑ VY ﹑ SR, etc .; C. High brightness: UG ﹑ UY ﹑ UR ﹑ UYS ﹑ URF. D. Visible light (infrared): IR, SIR ﹑ VIR ﹑ HIR; E. Infrared receiver tube T; F. Photoelectric tube: PD
2) By the composition of elements:
A. binary chip (phosphorus ﹑ gallium): H ﹑ G, etc .; B. ternary wafer (phosphorus ﹑ gallium ﹑ arsenic): SR ﹑HR ﹑UR; C. quaternary wafer (phosphorus ﹑ gallium ﹑ indium) : SRF, HRF, URF, VY, HY, UY, UYS, UE, HE, UG.
2.Led chip
1) According to the use of points: high power led chip, low power led chip two;
2) According to the color points: mainly divided into three kinds: red, green, blue (white raw materials);
3) According to the shape points: generally divided into square films, two discs;
4) According to the size points: low-power chip is generally divided into 8mil, 9mil, 12mil, 14mil and so on.
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